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Supply of IC packaging substrates for AI servers

Inside that server is a high-performance chip — and holding that chip together is a tiny but critical component called an IC package substrate. One Japanese company makes over half of the world's supply for servers. 2 billion to keep up with. TrendForce's latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2. The shortage of CoWoS has persisted, extending upstream to production equipment and downstream to substrates. By technology: organic AICS market recovers, reaching $14. 2 billion in 2024, with a growing market share of build-up IC substrates – GCS is coming closer to commercialization with strategic investments and pilot lines set up globally – SLP shipments reached 392 million units in 2024, with. The Japanese company Ibiden, headquartered in Ogaki, in the province of Gifu, maintains a prominent position in the global market for substrates for semiconductor packages. Essa company almost exclusively supplies the substrates used in artificial intelligence chips from Nvidia, the world leader in. Many AI mainboards use hybrid architectures–a combination of 20–30 traditional multilayer core layers for power distribution and two to eight HDI layers for ultra-dense signal routing. Other PCB Categories, 2023–2024. 2 billion to keep up with AI's insatiable appetite. When. Large dies and multi‑die packages need vast pin counts, high‑speed links to memory, clean power delivery, and robust thermal paths—all of which depend heavily on substrate design and materials.

Supply of IC packaging substrates for AI servers

AI server growth lifts ABF market, while BT substrates

A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain.

AI Competition Turns into a Supply Chain Arms Race, Tightening

TrendForce''s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

Ibiden Leads Global Market for Packaging Substrates on Advanced AI

Essa company almost exclusively supplies the substrates used in artificial intelligence chips from Nvidia, the world leader in GPUs for AI servers. Demand for these components has grown

Inside the AI Hardware Boom: Servers, Substrates and

Behind every AI chip and server is a PCB supplier rising to the challenge. Chinese companies like WUS, Gold Circuit (Taiwanese), Shengyi,

Ibiden''s $3.2 Billion Bet on AI: Japan''s IC Substrate Giant Plans to

Ibiden, the dominant supplier of IC package substrates to NVIDIA and Intel, has announced a massive $3.2 billion investment plan over three years to boost production capacity

Nvidia supplier Ibiden to expand IC substrate output

TOKYO -- Electronics maker Ibiden will boost production of integrated circuit package substrates used in generative AI servers, President and CEO Koji

IC Substrates for AI and High‑Performance Computing: Design and

This guide explains IC substrate design considerations for AI/HPC chips and compares key material options such as ABF, BT resin, ceramic, and glass, helping engineers and sourcing

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

AI Competition Turns into a Supply Chain Arms Race, Tightening

TrendForce''s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.

Ajinomoto Raises ABF Substrate Film Prices by 30%

Jukan (@jukan05). 245 likes 8 replies. Ajinomoto Raises ABF Substrate Film Prices by 30% - Japan''s Ajinomoto has decided to raise prices for its core ABF build-up film by 30%, with the

Stocks to Play Rubin Rack Manufacturing

Daniel Romero (@HyperTechInvest). 511 likes 11 replies. Stocks to Play Rubin Rack Manufacturing ━━━━━━━━━━━━━━━━━━ 🧠 MEMORY

Inside the AI Hardware Boom: Servers, Substrates and

AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting

Ajinomoto to Hike ABF Film Prices by 30% Amid AI Supercycle; Supply

Advertisements Driven by the relentless AI supercycle, the global advanced semiconductor packaging sector is grappling with a prolonged shortage of ABF substrates.

AMD CEO meets with TSMC CEO in Taiwan as it expands US chip

Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan''s industrial ecosystem to accelerate the development of artificial

Nvidia supplier Ibiden to expand IC substrate output

TOKYO -- Electronics maker Ibiden will boost production of integrated circuit package substrates used in generative AI servers, President and CEO Koji

Top 10 Companies in the IC Substrate Packaging Industry (2025):

As semiconductor complexity increases and form factors shrink, IC substrate manufacturers are innovating in materials, interconnect technologies, and thermal management.

Steady AI IC substrate orders and rising utilization boost

-advertisement- Orders for IC substrates for generative AI servers remain strong, and factory utilization rates are rising. Consequently, Japanese IC

Nvidia Supplier Ibiden Considers Accelerating Expansion to Meet AI

Ibiden Co., a major supplier of chip packaging substrates for Nvidia''s cutting-edge semiconductors, is considering accelerating its production capacity to meet the growing market

eeNews Analog

MEMS Packaging Substrates Market Set to Reach $3.23 Billion by 2030 Market news | November 1, 2025

iNEMI Packaging Tech Topic: Challenges and Solutions for AI Servers

Increasingly, processors and memory are being packaged close together on a single substrate for applications such as AI servers. For example, on the Nvidia H100 the GPU is connected

iNEMI Packaging Tech Topic: Challenges and Solutions for AI Servers

Increasingly, processors and memory are being packaged close together on a single substrate for applications such as AI servers. For example, on the Nvidia H100 the GPU is connected

AI server boom to fuel PCB industry optimism in 2025

Furthermore, advanced packaging technology is driving substrate designs towards larger areas, more layers, and finer circuits to meet the demand for more transistors and input/output (I/O). Currently,

AI Competition Turns into a Supply Chain Arms Race, Tightening

TrendForce''s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.

Ajinomoto Raises ABF Substrate Film Prices by 30%

Jukan (@jukan05). 245 likes 8 replies. Ajinomoto Raises ABF Substrate Film Prices by 30% - Japan''s Ajinomoto has decided to raise prices for its core ABF build-up film by 30%, with the

Stocks to Play Rubin Rack Manufacturing

Daniel Romero (@HyperTechInvest). 511 likes 11 replies. Stocks to Play Rubin Rack Manufacturing ━━━━━━━━━━━━━━━━━━ 🧠 MEMORY

Inside the AI Hardware Boom: Servers, Substrates and

AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting

Ajinomoto to Hike ABF Film Prices by 30% Amid AI Supercycle; Supply

Advertisements Driven by the relentless AI supercycle, the global advanced semiconductor packaging sector is grappling with a prolonged shortage of ABF substrates.

AMD CEO meets with TSMC CEO in Taiwan as it expands US chip

Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan''s industrial ecosystem to accelerate the development of artificial

AI accelerators and HPC: latest innovations in the

While the advanced packaging represented and still represents the stage of innovation to empower the More than Moore era, the advanced IC

Inside the AI Hardware Boom: Servers, Substrates and

AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting

IC Substrate The Core Cornerstone of Chip Packaging,

Conclusion: IC Substrates — The "Invisible Cornerstone" of the Semiconductor Industry Chain From mobile phones to AI servers, and from new

A Fine Future: IC Substrates Essentials, Part I

A growing demand for high-performance computing (HPC), driven by advanced AI applications, among others. It is important to note that miniaturizing is not a goal for data center

AI server growth lifts ABF market, while BT substrates

A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain.

AI Competition Turns into a Supply Chain Arms Race, Tightening

TrendForce''s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

Ibiden Leads Global Market for Packaging Substrates on Advanced AI

Essa company almost exclusively supplies the substrates used in artificial intelligence chips from Nvidia, the world leader in GPUs for AI servers. Demand for these components has grown

Inside the AI Hardware Boom: Servers, Substrates and

Behind every AI chip and server is a PCB supplier rising to the challenge. Chinese companies like WUS, Gold Circuit (Taiwanese), Shengyi,

Ibiden''s $3.2 Billion Bet on AI: Japan''s IC Substrate Giant Plans to

Ibiden, the dominant supplier of IC package substrates to NVIDIA and Intel, has announced a massive $3.2 billion investment plan over three years to boost production capacity

Nvidia supplier Ibiden to expand IC substrate output

TOKYO -- Electronics maker Ibiden will boost production of integrated circuit package substrates used in generative AI servers, President and CEO Koji

IC Substrates for AI and High‑Performance Computing: Design and

This guide explains IC substrate design considerations for AI/HPC chips and compares key material options such as ABF, BT resin, ceramic, and glass, helping engineers and sourcing

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

AI server growth lifts ABF market, while BT substrates

A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain.

AI Competition Turns into a Supply Chain Arms Race, Tightening

TrendForce''s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging.

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

Ibiden Leads Global Market for Packaging Substrates on Advanced AI

Essa company almost exclusively supplies the substrates used in artificial intelligence chips from Nvidia, the world leader in GPUs for AI servers. Demand for these components has grown

Inside the AI Hardware Boom: Servers, Substrates and

Behind every AI chip and server is a PCB supplier rising to the challenge. Chinese companies like WUS, Gold Circuit (Taiwanese), Shengyi,

Ibiden''s $3.2 Billion Bet on AI: Japan''s IC Substrate Giant Plans to

Ibiden, the dominant supplier of IC package substrates to NVIDIA and Intel, has announced a massive $3.2 billion investment plan over three years to boost production capacity

Nvidia supplier Ibiden to expand IC substrate output

TOKYO -- Electronics maker Ibiden will boost production of integrated circuit package substrates used in generative AI servers, President and CEO Koji

IC Substrates for AI and High‑Performance Computing: Design and

This guide explains IC substrate design considerations for AI/HPC chips and compares key material options such as ABF, BT resin, ceramic, and glass, helping engineers and sourcing

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

Pushed by glass core and high-end ICs substrates for

Advanced IC substrates are no longer passive packaging platforms. This ecosystem is becoming, step by step, a strategic enabler of semiconductor

Technical note

This reference is intended for preliminary ODN and passive infrastructure research. Topology, split ratio, box or cabinet capacity, closure rating, cable type, test limits and applicable standards must be verified for the specific project.

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