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Two-Optics-Three-Electrical Module

ODN and passive infrastructure knowledge brief Published 20 Sep 2023

Prepared for preliminary research by the GESTIONVAL ODN knowledge desk. Confirm network topology, split ratio, box or cabinet capacity, joint closure rating and loss budget against current standards and product documentation.

A Two-Optics-Three-Electrical Module integrates two photonic interface chiplets with three electrical interface chiplets using hybrid 2.5D/3D integration to achieve high-bandwidth, energy-efficient optical interconnects.Overview

A Two-Optics-Three-Electrical Module is a type of co-packaged optical module designed to combine multiple optical and electrical interfaces in a compact, high-performance package. These modules are increasingly used in data centers and high-performance computing to overcome bandwidth and energy bottlenecks associated with traditional pluggable optical transceivers and board-level electrical interconnects . The module typically integrates:

  • Two photonic interface chiplets (PICs) for optical signal generation and reception.
  • Three electrical interface chiplets (EICs) for high-speed electrical signal processing.
  • A compute chiplet (e.g., FPGA or switch ASIC) for data routing and processing.
Integration Technology

The module uses hybrid 2.5D/3D integration, which allows stacking and side-by-side placement of chiplets on an interposer or embedded multi-die interconnect bridge (EMIB). Key features include:

  • 3D stacking of EICs on PICs using micro-bumps (e.g., 55 µm pitch) to minimize signal path length and reduce power consumption.
  • 2.5D integration to connect the stacked chiplets to the main compute chiplet using high-density interposers (e.g., 45 µm pitch) for high aggregate bandwidth.
  • Wavelength-division multiplexing (WDM) to combine multiple optical channels onto a single fiber, enabling extremely high optical throughput .
Performance Characteristics
  • Each EIC/PIC stack can support 1,024 optical channels per direction, with 64 channels WDM per fiber.
  • Designed to operate at up to 16 Gb/s per channel, achieving a peak bi-directional optical bandwidth of 32 Tb/s per stack and 96 Tb/s aggregated across the module .
  • Co-packaging reduces electrical path lengths, lowering power consumption and cooling requirements compared to traditional pluggable transceivers .
  • Integration of optical engines and switch ASICs on the same board facilitates higher bandwidth density and supports future scaling to multi-terabit Ethernet switches .
Applications
  • Data center Ethernet switches requiring high-speed interconnects for AI and machine learning workloads.
  • High-performance computing clusters where inter-node communication is a limiting factor.
  • Next-generation optical networking where energy efficiency and compact form factor are critical.
Summary

The Two-Optics-Three-Electrical Module represents a state-of-the-art co-packaged optical solution, combining multiple optical and electrical chiplets using hybrid 2.5D/3D integration. This design enables ultra-high bandwidth, energy-efficient, and compact interconnects, addressing the growing demands of modern data centers and HPC systems .

Two-Optics-Three-Electrical Module - GESTIONVAL ODN INFRASTRUCTURE S.L. [PDF]

Two-Optics-Three-Electrical Module

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Technical note

This reference is intended for preliminary ODN and passive infrastructure research. Topology, split ratio, box or cabinet capacity, closure rating, cable type, test limits and applicable standards must be verified for the specific project.

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